IEC：EPGC203，JIS：EL-GEH，NEMA：G11，
G11 high temperature epoxy resin fiberglass board is created by compressing fiberglass cloth, soaked in high temperature resistant epoxy resin under heat with excellent mechanical and dielectric properties, good mechanical performance at high temperature and high humidity condition, and good processability.
PDF DOWNLOADG-11EPGC-203HGW2372.4EP3-High-Temperature-Epoxy-Resin-Fiberglass-Board.png
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